Multi-layered ceramic electronic component

ABSTRACT

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness T 1  of the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 μm or more and 30 μm or less, a thickness T 2  of the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 μm or more and 15 μm or less, and a thickness T 3  of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 μm or more and 10 μm or less.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2019-0077325 filed on Jun. 27, 2019 in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a multilayer ceramic electroniccomponent, and more particularly, to a method of manufacturing amultilayer ceramic electronic component having excellent reliability.

BACKGROUND

In general, an electronic component using a ceramic material such ascapacitors, inductors, piezoelectric elements, varistors, thermistors,or the like, includes a ceramic body formed of a ceramic material, aninternal electrode formed in the ceramic body, and an external electrodedisposed on a surface of the ceramic body to be connected to theinternal electrode.

A multilayer ceramic capacitor, of a multilayer ceramic electroniccomponent, may include a plurality of dielectric layers, internalelectrodes disposed to oppose each other with a dielectric layerinterposed therebetween, and an external electrode electricallyconnected to the internal electrode.

A multilayer ceramic capacitor is widely used as a component of a mobilecommunications device such as a computer, a PDA, a mobile phone, or thelike, due to having a small size, high capacity, and ease of mounting.

In recent years, to implement high-performance as well as lightweight,thin, short, and small devices within the electrical and electronicequipment industry, miniaturization, high performance, and ultra-highcapacity have been required for an electronic component.

In detail, according to the high capacity and miniaturization of amultilayer ceramic capacitor, a technique to significantly increase thecapacitance per unit volume is required.

Thus, in the case of an internal electrode, it is required that an areais increased while a volume is significantly reduced. In this case, ahigh capacity is required to be implemented by increasing the stackingnumber of layers.

However, according to the high capacity and miniaturization of amultilayer ceramic capacitor, reliability, in detail, moistureresistance reliability is required to be secured.

SUMMARY

An aspect of the present disclosure is to provide a multilayer ceramicelectronic component, and particularly, to a method of manufacturing amultilayer ceramic electronic component having excellent reliability.

According to an aspect of the present disclosure, a multilayer ceramicelectronic component includes a ceramic body including a dielectriclayer and a plurality of internal electrodes disposed to oppose eachother with the dielectric layer interposed therebetween, and having afirst surface and a second surface opposing each other in a thicknessdirection of the ceramic body, a third surface and a fourth surfaceconnected to the first surface and the second surface, and opposing eachother in a length direction of the ceramic body, and a fifth surface anda sixth surface connected to the first surface to the fourth surface,and opposing each other in a width direction of the ceramic body, and anexternal electrode disposed outside the ceramic body, and electricallyconnected to the internal electrode. The external electrode includes anelectrode layer electrically connected to one or more of the pluralityof internal electrodes, a first plating layer disposed on the electrodelayer, and a second plating layer disposed on the first plating layer,and in a cross-section of the ceramic body in first and seconddirections, a thickness T1 of the electrode layer corresponding to acentral region of the ceramic body in the thickness direction is 5 μm ormore and 30 μm or less, a thickness T2 of the electrode layercorresponding to a region in which an outermost internal electrode, ofthe internal electrode, is located is 5 μm or more and 15 μm or less,and a thickness T3 of the electrode layer corresponding to a cornerportion of the ceramic body is 0.1 μm or more and 10 μm or less.

Other features and aspects will be apparent from the following detaileddescription, the drawings, and the claims.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view illustrating a multilayer ceramiccapacitor according to an embodiment;

FIG. 2 is a schematic view illustrating a ceramic body according to anembodiment of the present disclosure;

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1; and

FIG. 4 is an enlarged view of region ‘B’ of FIG. 3.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described asfollows with reference to the attached drawings.

The present disclosure may, however, be exemplified in many differentforms and should not be construed as being limited to the specificembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the disclosure to those skilled in the art.

Throughout the specification, it will be understood that when anelement, such as a layer, region or wafer (substrate), is referred to asbeing “on,” “connected to,” or “coupled to” another element, it can bedirectly “on,” “connected to,” or “coupled to” the other element orother elements intervening therebetween may be present. In contrast,when an element is referred to as being “directly on,” “directlyconnected to,” or “directly coupled to” another element, there may be noelements or layers intervening therebetween. Like numerals refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be apparent that though the terms first, second, third, etc. maybe used herein to describe various members, components, regions, layersand/or sections, these members, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one member, component, region, layer or section fromanother region, layer or section. Thus, a first member, component,region, layer or section discussed below could be termed a secondmember, component, region, layer or section without departing from theteachings of the exemplary embodiments.

Spatially relative terms, such as “above,” “upper,” “below,” and “lower”and the like, may be used herein for ease of description to describe oneelement's relationship to another element(s) as shown in the figures. Itwill be understood that the spatially relative terms are intended toencompass different orientations of the device in use or operation inaddition to the orientation depicted in the figures. For example, if thedevice in the figures is turned over, elements described as “above,” or“upper” other elements would then be oriented “below,” or “lower” theother elements or features. Thus, the term “above” can encompass boththe above and below orientations depending on a particular direction ofthe figures. The device may be otherwise oriented (rotated 90 degrees orat other orientations) and the spatially relative descriptors usedherein may be interpreted accordingly.

The terminology used herein describes particular embodiments only, andthe present disclosure is not limited thereby. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. It willbe further understood that the terms “comprises,” and/or “comprising”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, members, elements, and/or groupsthereof, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, members, elements, and/orgroups thereof.

Hereinafter, embodiments of the present disclosure will be describedwith reference to schematic views illustrating embodiments of thepresent disclosure. In the drawings, for example, due to manufacturingtechniques and/or tolerances, modifications of the shape shown may beestimated. Thus, embodiments of the present disclosure should not beconstrued as being limited to the particular shapes of regions shownherein, for example, to include a change in shape results inmanufacturing. The following embodiments may also be constituted by oneor a combination thereof.

The contents of the present disclosure described below may have avariety of configurations and propose only a required configurationherein, but are not limited thereto.

The present invention relates to a ceramic electronic component, and anelectronic component including a ceramic material may be a capacitor, aninductor, a piezoelectric element, a varistor, a thermistor, or thelike. A multilayer ceramic capacitor as an example of a ceramicelectronic component will be described below.

FIG. 1 is a schematic perspective view illustrating a multilayer ceramiccapacitor according to an embodiment.

FIG. 2 is a schematic view illustrating a ceramic body according to anembodiment of the present disclosure.

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1.

FIG. 4 is an enlarged view of region ‘B’ of FIG. 3.

Referring to FIGS. 1 to 4, a multilayer ceramic capacitor according toan embodiment may include a ceramic body 110, internal electrodes 121and 122 formed inside the ceramic body 100, and external electrodes 131and 132 formed outside the ceramic body 110.

In an embodiment, a ‘length direction’ of a multilayer ceramic capacitoris defined as an ‘L’ direction, a ‘width direction’ is defined as a ‘W’direction, and a ‘thickness direction’ is defined as a ‘T’ direction ofFIG. 1. The ‘thickness direction’ may be used as a direction in whichdielectric layers are stacked, that is, a ‘stacking direction.’

A form of the ceramic body 110 is not particularly limited, but theceramic body may have a hexahedral form, according to an embodiment.

The ceramic body 110 may include a first surface S1 and a second surfaceS2, opposing each other in a first direction, a third surface S3 and afourth surface S4, connected to the first surface S1 and the secondsurface S2, and opposing each other in a second direction, and a fifthsurface S5 and a sixth surface S6, connected to the first surface to thefourth surface S1 to S4, and opposing each other in a third direction.

The first surface S1 and the second surface S2 may be defined assurfaces opposing each other in a thickness direction of the ceramicbody 110, a first direction, the third surface S3 and the fourth surfaceS4 may be defined as surfaces opposing each other in a length direction,a second direction, and the fifth surface S5 and the sixth surface S6may be defined as surfaces opposing each other in a width direction, athird direction.

One end of each of a plurality of internal electrodes 121 and 122,formed inside the ceramic body 110, is exposed to the third surface S3or the fourth surface S4 of the ceramic body 110.

The internal electrodes 121 and 122 may be provided as a pair ofinternal electrodes, including a first internal electrode 121 and asecond internal electrode 122, having different polarities.

One end of the first internal electrode 121 is exposed to the thirdsurface S3, and one end of the second internal electrode 122 is exposedto the fourth surface S4.

The other ends of the first internal electrode 121 and the secondinternal electrode 122 may be formed at a regular interval from thefourth surface S4 or the third surface S3.

First and second external electrodes 131 and 132 are formed on the thirdsurface S3 and the fourth surface S4 of the ceramic body 110 to beelectrically connected to the first and second internal electrodes 121and 122, respectively.

Thicknesses of the first and second internal electrodes 121 and 122 arenot particularly limited, but may be equal to 0.4 μm or less, by way ofexample.

According to an embodiment, a dielectric layer with an internalelectrode formed therein may be stacked in an amount of 200 layers ormore.

According to an embodiment, the ceramic body 110 may be formed bystacking a plurality of dielectric layers 111.

The plurality of dielectric layers 111, forming the ceramic body 110,are sintered, so boundaries between adjacent dielectric layers may beintegrated and may not be readily identified with the naked eye.

The dielectric layer 111 may be formed by sintering a ceramic greensheet including ceramic powder.

The ceramic powder is not particularly limited as long as it isgenerally used in the art.

It is not particularly limited, and the ceramic powder may include, forexample, BaTiO₃-based ceramic powder.

The BaTiO₃-based ceramic powder is not particularly limited, and may be(Ba_(1-x)Ca_(x))TiO₃, Ba(Ti_(1-y)Ca_(y))O₃, (Ba_(1-x)Ca_(x))(Ti_(1-y)Zr_(y))O₃, Ba(Ti_(1-y)Zr_(y))O₃, or the like, in which aportion such as Ca, Zr, or the like is dissolved in BaTiO₃, by way ofexample.

Moreover, the ceramic green sheet may include a transition metal, a rareearth element, Mg, Al, or the like, together with the ceramic powder.

A thickness of the dielectric layer 111 may be varied as appropriate tothe capacity design of a multilayer ceramic capacitor.

It is not particularly limited, and a thickness of the dielectric layer111, formed between two adjacent internal electrode layers, may be 0.4μm or less, by way of example.

In an embodiment, a thickness of the dielectric layer 111 refers to anaverage thickness.

The average thickness of the dielectric layer 111 may be measured byscanning a cross-section of the ceramic body 110 in a length directionas illustrated in FIG. 2 as an image using a scanning electronmicroscope (SEM).

For example, as illustrated in FIG. 2, regarding on any dielectric layerextracted from an image in which a cross-section, obtained by cutting acentral portion of the ceramic body 110 in a width (W) direction, isscanned in a length-thickness direction (L-T) using a scanning electronmicroscope (SEM), a thickness of equally-spaced 30 points is measured ina length direction to measure an average value.

The measurement of the equally-spaced 30 points may be performed in acapacitance forming portion referring to a region in which the internalelectrodes 121 and 122 are overlapped.

Moreover, regarding the measurement of the average value, when anaverage value is measured using 10 or more dielectric layers, an averagethickness of a dielectric layer may be further generalized.

The ceramic body 110 may include an active portion A, as a portioncontributing to the capacity formation of the capacitor, as well as anupper cover portion C1 and a lower cover portion C2, formed in upper andlower portions of the active portion A, as upper and lower marginportions.

The active portion A may be formed by repeatedly stacking a plurality offirst and second internal electrodes 121 and 122 with the dielectriclayer 111 interposed therebetween.

The upper cover portion C1 and the lower cover portion C2 may have thesame material and configuration as those of the dielectric layers 111except that the upper cover portion C1 and the lower cover portion C2 donot include internal electrodes.

That is, the upper cover portion C1 and the lower cover portion C2include a ceramic material, and may include, for example, a bariumtitanate (BaTiO₃)-based ceramic material.

The upper cover portion C1 and the lower cover portion C2 may be formedby stacking a single dielectric layer or two or more dielectric layerson upper and lower surfaces of the active portion A in a verticaldirection, and may basically serve to prevent damage to an internalelectrode by physical or chemical stress.

Each of the upper cover portion C1 and the lower cover portion C2 mayhave a thickness of 20 μm or less, but an embodiment is not limitedthereto.

In recent years, according to a high-performance as well as lightweight,thin, short, and small of an electrical and electronic equipmentindustry, the miniaturization, high performance, and ultra-high capacityhave been required for an electronic component. Accordingly, asdescribed above, thicknesses of upper and lower cover portions, disposedinside a ceramic body, have recently been reduced.

As in an embodiment, when each of the upper cover portion C1 and thelower cover portion C2 has a thickness of 20 μm or less, a thickness ofa cover portion is small, so it is easy for moisture and a platingsolution to penetrate from outside to the active region A. Thus, thepossibility of moisture resistance reliability failure may be increased.

According to an embodiment, thicknesses for each position, of anelectrode layer, disposed outside a ceramic body, and a plating layerthereon, are controlled, so moisture resistance reliability may beimproved.

That is, in an embodiment, in an ultra-small high capacity multilayerceramic capacitor, when each of the upper cover portion C1 and the lowercover portion C2 has a thin thickness, equal to or less than 20 μm, inorder to improve moisture resistance reliability, a thickness of each ofan electrode layer and a plating layer, included in an externalelectrode, is controlled for each position.

Thus, in the case of a multilayer ceramic capacitor according to therelated art, in which a thickness of each of an upper cover portion C1and a lower cover portion C2 exceeds 20 μm, moisture resistancereliability may not be significantly affected, even when a thickness foreach position of each of an electrode layer and a plating layer is notcontrolled in a cross-section in a length-thickness direction and across-section in a width-thickness direction, as in an embodiment of thepresent disclosure.

Here, a material, forming the first and second internal electrodes 121and 122, is not particularly limited. For example, the first and secondinternal electrodes 121 and 122 may be formed using a conductive pastecontaining at least one among silver (Ag), lead (Pb), platinum (Pt),nickel (Ni), and copper (Cu).

The multilayer ceramic capacitor according to an embodiment may includea first external electrode 131 electrically connected to the firstinternal electrode 121 and a second external electrode 132 electricallyconnected to the second internal electrode 122.

The first and second external electrodes 131 and 132 may be electricallyconnected to the first and second internal electrodes 121 and 122 forcapacitance formation, and the second external electrode 132 may beconnected to a potential different from that of the first externalelectrode 131.

The first and second external electrodes 131 and 132 may be disposed onthe third surface S3 and the fourth surface S4 in a length direction, asecond direction of the ceramic body 110, respectively, and may extendonto the first surface S1 and the second surface S2 in a thicknessdirection, a first direction of the ceramic body 110.

The external electrodes 131 and 132 are disposed outside the ceramicbody 111, and may include electrode layers 131 a and 132 a electricallyconnected to the internal electrodes 121 and 122, first plating layers131 b and 132 b disposed on the electrode layers 131 a and 132 a, andsecond plating layers 131 c and 132 c disposed on the first platinglayers 131 b and 132 b, respectively.

The external electrodes 131 and 132 include a first external electrode131 and a second external electrode 132, disposed on one side and theother side of the ceramic body 111, respectively.

The electrode layers 131 a and 132 a may include a conductive metal andglass.

The conductive metal, used for the electrode layers 131 a and 132 a, isnot particularly limited as long as a material is electrically connectedto the internal electrode for capacitance formation. For example, theconductive metal may be one or more selected from the group consistingof copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

The electrode layers 131 a and 132 a may be formed by sintering aconductive paste provided by adding glass frit to the conductive metalpowder.

That is, the electrode layers 131 a and 132 a may be a sintering typeelectrode formed by sintering paste including a conductive metal.

The conductive metal, included in the electrode layers 131 a and 132 a,is electrically conducted with the first and second internal electrodes121 and 122, thereby implementing electrical characteristics.

The glass, included in the electrode layers 131 a and 132 a, actstogether with the conductive metal as a sealing material for blockingexternal moisture.

The first external electrode 131 includes: a first electrode layer 131 adisposed on one surface of the ceramic body 110 in a length (L)direction, the second direction, and electrically connected to the firstinternal electrode 121; a first plating layer 131 b disposed on thefirst electrode layer 131 a; and a second plating layer 131 c disposedon the first plating layer 131 b.

Moreover, the second external electrode 132 includes: a second electrodelayer 132 a disposed on the other surface of the ceramic body 110 in alength (L) direction, the second direction, and electrically connectedto the second internal electrode 122; a first plating layer 132 bdisposed on the second electrode layer 132 a; and a second plating layer132 c disposed on the first plating layer 132 b.

The electrode layers 131 a and 132 a are disposed on both side surfacesof the ceramic body 110 in a length (L) direction, and may extended ontoportions of the first surface S1 and the second surface S2, which are anupper surface and a lower surface of the ceramic body 110.

In addition, plating layers 131 b, 131 c, 132 b, and 132 c may bedisposed on upper portions of the electrode layers 131 a and 132 a.

The electrode layers 131 a and 132 a may be formed of the sameconductive metal as that of the first and second internal electrodes 121and 122, but are not limited thereto. For example, the electrode layersmay be formed of one among copper (Cu), silver (Ag), nickel (Ni), andthe like, or alloys thereof.

The first plating layers 131 b and 132 b are not particularly limited,and may be a nickel plating layer, while the second plating layers 131 cand 132 c, disposed on the first plating layers 131 b and 132 b, may bea tin plating layer.

According to an embodiment, in cross-sections of the ceramic body 110 infirst and second directions, a thickness T1 of the electrode layers 131a and 132 a corresponding to a central region of the ceramic body 110 ina thickness direction is 5 μm or more and 30 μm or less, a thickness T2of the electrode layers 131 a and 132 a corresponding to a region inwhich an outermost internal electrode of the internal electrodes 121 and122 is located is 5 μm or more and 15 μm or less, and a thickness T3 ofthe electrode layers 131 a and 132 a corresponding to a corner portionof the ceramic body 110 may be 0.1 μm or more and 10 μm or less.

The first direction is a thickness direction of the ceramic body 110,the second direction is a length direction of the ceramic body 110, andcross-sections of the ceramic body 110 in the first and seconddirections refer to cross-sections in a length-thickness direction.

It is controlled that a thickness T1 of the electrode layers 131 a and132 a corresponding to a central region of the ceramic body 110 in athickness direction is 5 μm or more and 30 μm or less, a thickness T2 ofthe electrode layers 131 a and 132 a corresponding to a region in whichan outermost internal electrode of the internal electrodes 121 and 122is located is 5 μm or more and 15 μm or less, and a thickness T3 of theelectrode layers 131 a and 132 a corresponding to a corner portion ofthe ceramic body 110 may be 0.1 μm or more and 10 μm or less. Thus,moisture resistance reliability of a multilayer ceramic electroniccomponent may be improved. The thickness T2 may be less than thethickness T1 and be greater than the thickness T3.

That is, in order to prevent degradation of moisture resistancereliability of a multilayer ceramic electronic component, it is requiredthat a thickness T1 of the electrode layers 131 a and 132 acorresponding to a central region of the ceramic body 110 in a thicknessdirection is at least 5 μm, in cross-sections of the ceramic body 110 infirst and second directions.

In addition, it is required that a thickness T2 of the electrode layers131 a and 132 a corresponding to a region in which an outermost internalelectrode, of the internal electrodes 121 and 122, is located is atleast 5 μm.

Moreover, it is required that a thickness T3 of the electrode layers 131a and 132 a corresponding to a corner portion of the ceramic body 110 isat least 0.1 μm.

In detail, after sintering, a thickness of the dielectric layer 111 maybe 0.4 μm or less, and a thickness of each of the first and secondinternal electrodes 121 and 122 is 0.4 μm or less. Here, in the case ofa product, to which the dielectric layer and the internal electrodehaving a thin film described above are applied, moisture resistancereliability may be degraded.

Here, a thickness of the dielectric layer 111 is 0.4 μm or less, and athickness of each of the first and second internal electrodes 121 and122 is 0.4 μm or less. In this case, as in an embodiment, incross-sections of the ceramic body 110 in first and second directions, athickness T1 of the electrode layers 131 a and 132 a corresponding to acentral region of the ceramic body 110 in a thickness direction iscontrolled to be 5 μm or more, a thickness T2 of the electrode layers131 a and 132 a corresponding to a region in which an outermost internalelectrode, of the internal electrodes 121 and 122, is located iscontrolled to be 5 μm or more, and a thickness T3 of the electrodelayers 131 a and 132 a corresponding to a corner portion of the ceramicbody 110 is controlled to be 0.1 μm or more. Only when the thicknessesare controlled as described above, degradation of moisture resistancereliability may be prevented.

If a thickness T1 of each of the electrode layers 131 a and 132 acorresponding to a central region of the ceramic body 110 in a thicknessdirection is less than 5 μm, moisture resistance reliability may bedegraded.

Moreover, if a thickness T2 of each of the electrode layers 131 a and132 a corresponding to a region in which an outermost internalelectrode, of the internal electrodes 121 and 122, is located is lessthan 5 μm, moisture resistance reliability may be degraded.

In addition, if a thickness T3 of each of the electrode layers 131 a and132 a corresponding to a corner portion of the ceramic body 110 is lessthan 0.1 μm, moisture resistance reliability may be degraded.

In detail, if a thickness of the dielectric layer 111 is 0.4 μm or less,and a thickness of each of the first and second internal electrodes 121and 122 is 0.4 μm or less, and a thickness of each of the electrodelayers 131 a and 132 a in each region is less than the respective valuedescribed above, moisture resistance reliability may be degraded.

Here, the meaning of the thin film is not that a thickness of thedielectric layer 111 and each of the first and second internalelectrodes 121 and 122 is 0.4 μm or less, and may be understood as theconcept of including the dielectric layer and the internal electrode,having a reduced thickness, as compared with the product according tothe related art.

On the other hand, in cross-sections of the ceramic body 110 in firstand second directions, a thickness T1 of the electrode layers 131 a and132 a corresponding to a central region of the ceramic body 110 in athickness direction exceeds 30 μm, a thickness T2 of the electrodelayers 131 a and 132 a corresponding to a region in which an outermostinternal electrode, of the internal electrodes 121 and 122, is locatedexceeds 15 μm, and a thickness T3 of the electrode layers 131 a and 132a corresponding to a corner portion of the ceramic body 110 exceeds 10μm. In this case, moisture resistance reliability may be improved.However, a high-capacity multilayer ceramic electronic component cannotbe implemented.

In cross-sections of the ceramic body 110 in first and seconddirections, among a thickness T1 of the electrode layers 131 a and 132 acorresponding to a central region of the ceramic body 110 in a thicknessdirection, a thickness T2 of the electrode layers 131 a and 132 acorresponding to a region in which an outermost internal electrode, ofthe internal electrodes 121 and 122, is located, and a thickness T3 ofthe electrode layers 131 a and 132 a corresponding to a corner portionof the ceramic body 110, if any number among the thicknesses is outsideof a numerical range according to an embodiment of the presentdisclosure, moisture resistance reliability may be degraded.

According to an embodiment, in a 1005 size (Length×Width:1.0 mm×0.5 mm)or less of the multilayer ceramic electronic component 100, a thicknessT1 of each of the electrode layers 131 a and 132 a corresponding to acentral region of the ceramic body 110 in a thickness direction may be15 μm or more and 30 μm or less.

Moreover, in the 1005 size (Length×Width:1.0 mm×0.5 mm) or less of themultilayer ceramic electronic component 100, a thickness T2 of each ofthe electrode layers 131 a and 132 a corresponding to a region in whichan outermost internal electrode, of the internal electrodes 121 and 122,is located may be 5 μm or more and 15 μm or less.

Moreover, in the 1005 size (Length×Width:1.0 mm×0.5 mm) or less of themultilayer ceramic electronic component 100, a thickness T3 of each ofthe electrode layers 131 a and 132 a corresponding to a corner portionof the ceramic body 110 may be 1 μm or more and less than 9 μm.

In an embodiment, in the 1005 size (Length×Width:1.0 mm×0.5 mm) or lessof the multilayer ceramic electronic component 100, a thickness of eachof the electrode layers 131 a and 132 a in the each region satisfies therespective numerical range, so moisture resistance reliability of aultra-small and high capacity multilayer ceramic electronic componentmay be improved.

In the 1005 size (Length×Width:1.0 mm×0.5 mm) or less of the multilayerceramic electronic component 100, if a thickness T1 of each of theelectrode layers 131 a and 132 a corresponding to a central region ofthe ceramic body 110 in a thickness direction is less than 15 μm,moisture resistance reliability may be degraded.

Moreover, in the 1005 size (Length×Width:1.0 mm×0.5 mm) or less of themultilayer ceramic electronic component 100, if a thickness T2 of eachof the electrode layers 131 a and 132 a corresponding to a region inwhich an outermost internal electrode, of the internal electrodes 121and 122, is located is less than 5 μm, moisture resistance reliabilitymay be also degraded.

In addition, in the 1005 size (Length×Width:1.0 mm×0.5 mm) or less ofthe multilayer ceramic electronic component 100, if a thickness T3 ofeach of the electrode layers 131 a and 132 a corresponding to a cornerportion of the ceramic body 110 is less than 1 μm, moisture resistancereliability may be degraded. The thickness T2 may be less than thethickness T1 and be greater than the thickness T3.

On the other hand, in the 1005 size (Length×Width:1.0 mm×0.5 mm) or lessof the multilayer ceramic electronic component 100, a thickness T1 ofthe electrode layers 131 a and 132 a corresponding to a central regionof the ceramic body 110 in a thickness direction exceeds 25 μm, athickness T2 of the electrode layers 131 a and 132 a corresponding to aregion in which an outermost internal electrode, of the internalelectrodes 121 and 122, is located exceeds 15 μm, and a thickness T3 ofthe electrode layers 131 a and 132 a corresponding to a corner portionof the ceramic body 110 is 9 μm or more. In this case, moistureresistance reliability may be improved. However, a high-capacitymultilayer ceramic electronic component cannot be implemented.

In an embodiment, the 1005 size (Length×Width:1.0 mm×0.5 mm) or less mayrefer to a 1005 size (Length×Width:1.0 mm×0.5 mm) and a 0603 size(Length×Width:0.6 mm×0.3 mm), but an embodiment is not limited theretoand the 1005 size or less may be applied to a size equal to or less thanthe same.

According to an embodiment, a thickness T1 b of each of the firstplating layers 131 b and 132 b corresponding to a central region of theceramic body 110 in a thickness direction may be 3 μm to 5 μm.

If a thickness T1 b of each of the first plating layers 131 b and 132 bcorresponding to a central region of the ceramic body 110 in a thicknessdirection is less than 3 μm, a frequency of plating interruption may beincreased, so reliability may be degraded.

If a thickness T1 b of each of the first plating layers 131 b and 132 bcorresponding to a central region of the ceramic body 110 in a thicknessdirection exceeds 5 μm, a high capacity multilayer ceramic electroniccomponent may not be implemented.

Hereinafter, a method of manufacturing a multilayer ceramic capacitoraccording to an embodiment will be described.

According to an embodiment, a plurality of ceramic green sheets may beprovided.

Regarding a ceramic green sheet, a ceramic powder, a binder, and asolvent are mixed to prepare slurry, and the slurry is manufactured as asheet having a thickness of several μm using a doctor blade method.Then, the ceramic green sheet is sintered, and then may form adielectric layer 111 as illustrated in FIG. 2.

A thickness of the ceramic green sheet may be 0.6 μm or less, and thus athickness of a dielectric layer after sintering may be 0.4 μm or less.

Then, a conductive paste for an internal electrode is applied on theceramic green sheet to form an internal electrode pattern. The internalelectrode pattern may be formed using screen printing or gravureprinting.

The conductive paste for an internal electrode includes a conductivemetal and an additive, and the additive may be one or more betweennon-metallic and metallic oxides.

The conductive metal may include nickel. The additive, may includebarium titanate or strontium titanate as a metallic oxide.

A thickness of the internal electrode pattern may be 0.5 μm or less, andthus a thickness of an internal electrode after sintering may be 0.4 μmor less.

Then, ceramic green sheets with the internal electrode pattern formedtherein are stacked, and then pressed in a stacking direction, so theceramic green sheets may be pressed. Thus, a ceramic laminate having aninternal electrode pattern formed therein may be manufactured.

Then, a ceramic laminate may be cut for each region corresponding to asingle capacitor to be provided as a chip.

In this case, cutting may be performed to allow one end of the internalelectrode pattern to be alternately exposed through a side surface.

Then, a laminate, provided as a chip, is sintered to manufacture aceramic body.

The sintering process may be performed in a reducing atmosphere.Moreover, the sintering process may be performed by controlling aheating rate. An embodiment is not particularly limited, and the heatingrate may be 30° C./60 s to 50° C./60 s at 700° C. or less.

Then, an external electrode may be formed to be electrically connectedto an internal electrode exposed to a side surface of a ceramic body,while covering the side surface of the ceramic body. Then, a platinglayer such as nickel, tin, or the like, may be formed on a surface ofthe external electrode.

Hereinafter, the present disclosure will be described in detail withreference to the Example and the Comparative Example.

A multilayer ceramic capacitor according to the Example and theComparative Example was prepared in the following manner.

Barium titanate powder, ethanol as an organic solvent, and polyvinylbutyral as a binder were mixed, and then ball milling was performed tomanufacture ceramic slurry, and a ceramic green sheet was manufacturedusing the ceramic slurry.

A conductive paste for an internal electrode containing nickel wasprinted on a ceramic green sheet to form an internal electrode, andinternal electrodes were stacked to obtain a green laminate. Then, thegreen laminate was isostatic pressed at a pressure of 1,000 kgf/cm² at85° C.

The pressed green laminate was cut to manufacture a green chip, and thecut green chip was maintained for 60 hours at 230° C. under atmosphericconditions in a de-binder process. After the de-binder process, thegreen chip was sintered at 1000° C. to manufacture a sintered chip.Sintering was performed in a reducing atmosphere to prevent oxidation ofan internal electrode, and the reducing atmosphere was provided to be10⁻¹¹ atm to 10⁻¹⁰ atm, lower than the Ni/NiO equilibrium oxygen partialpressure.

A paste for an external electrode including copper powder and glasspowder was used to form an electrode layer outside a sintered chip, anda nickel plating layer and a tin plating layer were formed byelectroplating on the electrode layer.

A multilayer ceramic capacitor having a 1005 size was manufacturedaccording to the above method. In the 1005 size, a length and a widthare 1.0 mm±0.1 mm and 0.5 mm±0.1 mm, respectively. Characteristics ofthe multilayer ceramic capacitor were evaluated as follows.

In Table 1, measurement results of a capacity increase rate, a frequencyof plating interruption, a high temperature/high pressure reliabilityfailure frequency, and a moisture resistance reliability failurefrequency were compared according to a thickness of an electrode layerfor each position in Comparative Example and Example.

400 samples of each of Comparative Example and Example were selected,and the evaluation of the high temperature/high pressure reliabilityfailure frequency and the moisture resistance reliability failurefrequency was performed according to a thickness for each position.

The high temperature/high pressure reliability evaluation was performedunder conditions of 2 Vr and 150° C., and the moisture resistancereliability evaluation was performed under conditions of 1 Vr and 8585(85° C. and relative humidity 85%).

TABLE 1 High Temperature/ Moisture High Pressure Resistance CapacityFrequency Reliability Reliability T1 T2 T3 Increase of Plating FailureFailure (μm) (μm) (μm) Rate (%) Interruption Frequency Frequency 1* 4 51 +9.0 0/100 8/400 7/400 2* 10 5 1 +8.0 0/100 5/400 0/400 3  15 5 1 +7.00/100 0/400 0/400 4* 20 1 1 +5.0 0/100 1/400 0/400 5* 3 1 1/100 0/4001/400 6* 5 0.1 99/100  14/400  12/400  7* 5 0.5 78/100  8/400 4/400 8  51 0/100 0/400 0/400 9  5 3 0/100 0/400 0/400 10  10 1 0/100 0/400 0/40011  15 1 0/100 0/400 0/400 12  30 5 1 +2.0 0/100 0/400 0/400 13  10 10/100 0/400 0/400 14*  40 5 1 0.0 0/100 0/400 0/400 15*  10 1 0/1000/400 0/400 *Comparative Example

Referring to Table 1, in a 1005 size (Length×Width:1.0 mm×0.5 mm) orless, a sample 1, Comparative Example, is the case in which a thicknessT1 of the electrode layer corresponding to a central region of a ceramicbody in a thickness direction is 4 μm, which is less than 5 μm. In thiscase, although a capacity increase rate is high, the hightemperature/high pressure reliability and moisture resistancereliability failure frequency may be high, so it can be seen that thereis a problem in reliability.

Moreover, in the 1005 size (Length×Width:1.0 mm×0.5 mm) or less, asample 2, Comparative Example, is the case in which the sum T1 ofthicknesses of the electrode layer and the first plating layercorresponding to a central region of a ceramic body in a thicknessdirection is 10 μm, which is less than 15 μm. In this case, although acapacity increase rate is high, the high temperature/high pressurereliability failure frequency may be high, so it can be seen that thereis a problem in reliability.

In addition, in the 1005 size (Length×Width:1.0 mm×0.5 mm) or less,samples 14 and 15, Comparative Example, are the case in which athickness T1 of the electrode layer corresponding to a central region ofthe ceramic body in a thickness direction is 40 μm, which exceeds 30 μm.In this case, there is no problem of moisture resistance reliability,but a capacity increase rate is 0%, so a high capacity multilayerceramic electronic component may not be implemented.

Moreover, in the 1005 size (Length×Width:1.0 mm×0.5 mm) or less, samples4 to 7, Comparative Example, are the case in which a thickness T2 of theelectrode layer corresponding to a region in which an outermost internalelectrode, of the internal electrode, is located, and a thickness T3 ofthe electrode layer corresponding to a corner portion of the ceramicbody are outside of a numerical range according to an embodiment of thepresent disclosure. In this case, many failures occur at the frequencyof plating interruption, the high temperature/high pressure reliabilityfailure frequency, and the moisture resistance reliability failurefrequency, so it can be seen that there is a problem in reliability.

On the other hand, in the 1005 size (Length×Width:1.0 mm×0.5 mm) orless, a sample 3 and samples 8 to 13 are the case in which it issatisfied with a numerical range according to an embodiment of thepresent disclosure. In this case, it can be seen that a high capacitymultilayer ceramic capacitor with excellent moisture resistancereliability may be implemented.

As set forth above, according to an embodiment in the presentdisclosure, a thickness of a sintered electrode layer including aconductive metal and glass, of an external electrode, is controlled byposition, so moisture resistance characteristics can be improved andreliability can be improved.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A multilayer ceramic electronic component,comprising: a ceramic body including a dielectric layer and a pluralityof internal electrodes disposed to oppose each other with the dielectriclayer interposed therebetween, and having a first surface and a secondsurface opposing each other in a thickness direction of the ceramicbody, a third surface and a fourth surface connected to the firstsurface and the second surface, and opposing each other in a lengthdirection of the ceramic body, and a fifth surface and a sixth surfaceconnected to the first surface to the fourth surface, and opposing eachother in a width direction of the ceramic body; and an externalelectrode disposed outside the ceramic body, and electrically connectedto one or more of the plurality of internal electrodes, wherein theexternal electrode includes an electrode layer electrically connected tothe one or more of the plurality of internal electrodes, a first platinglayer disposed on the electrode layer, and a second plating layerdisposed on the first plating layer, and a thickness T1 of the electrodelayer corresponding to a central region of the ceramic body in thethickness direction is 5 μm or more and 30 μm or less, a thickness T2 ofthe electrode layer corresponding to a region in which an outermostinternal electrode, of the internal electrodes, is located is 5 μm ormore and 15 μm or less, and a thickness T3 of the electrode layercorresponding to a corner portion of the ceramic body is 0.1 μm or moreand 10 μm or less, in a cross-section of the ceramic body in thethickness and length directions.
 2. The multilayer ceramic electroniccomponent of claim 1, wherein a size of the multilayer ceramicelectronic component is a 1005 size (Length×Width:1.0 mm×0.5 mm) orless, and the thickness T1 is 15 μm or more and 30 μm or less.
 3. Themultilayer ceramic electronic component of claim 1, wherein a size ofthe multilayer ceramic electronic component is a 1005 size(Length×Width:1.0 mm×0.5 mm) or less.
 4. The multilayer ceramicelectronic component of claim 1, wherein a size of the multilayerceramic electronic component is a 1005 size (Length×Width:1.0 mm×0.5 mm)or less, and the thickness T3 is 1 μm or more and less than 9 μm.
 5. Themultilayer ceramic electronic component of claim 1, wherein a thicknessof the dielectric layer is 0.4 μm or less, and a thickness of one of theplurality of the internal electrodes is 0.4 μm or less.
 6. Themultilayer ceramic electronic component of claim 1, wherein the ceramicbody includes an active portion forming capacity and including theplurality of internal electrodes disposed to oppose each other with thedielectric layer interposed therebetween, and cover portions disposed onan upper portion and a lower portion of the active portion,respectively, and a thickness of each of the cover portions is 20 μm orless.
 7. The multilayer ceramic electronic component of claim 1, whereina thickness T1 b of the first plating layer corresponding to the centralregion of the ceramic body in the thickness direction is 3 μm to 5 μm.8. The multilayer ceramic electronic component of claim 1, wherein theelectrode layer is a sintered electrode including a conductive metal andglass.
 9. The multilayer ceramic electronic component of claim 1,wherein the thickness T2 is less than the thickness T1 and is greaterthan the thickness T3.
 10. The multilayer ceramic electronic componentof claim 1, wherein an average thickness of the dielectric layer is 0.4μm or less.
 11. The multilayer ceramic electronic component of claim 1,wherein an average thickness of one of the plurality of the internalelectrodes is 0.4 μm or less.
 12. The multilayer ceramic electroniccomponent of claim 1, wherein an average thickness of the dielectriclayer is 0.4 μm or less, and an average thickness of one of theplurality of the internal electrodes is 0.4 μm or less.